DS200TCQCG1AJD

The DS200TCQCG1AJD features an innovative modular design for increased scalability and flexibility. Customers can select different functional modules (compute, switch, storage and IO modules) to build highly customized computing platforms based on their specific application requirements. The hybrid design allows customers to mix and match between 1/4 and 1/2 width slot compute nodes in order to scale the number of independent systems with different processing power in the platform as needed. The modules feature native virtualization for SDN/NFV. For SDN, the MICA switch module uses larger TCAM tables for fast L2/L3/L4 packet forwarding over OpenFlow. For NFV, MICA switch modules and cards support hardware accelerated processing for NVGRE and VXLAN tunneling protocols, and the MICA design integrates a variety of the latest hardware acceleration technologies to enhance the processing of network packets and video streams

The DS200TCQCG1AJD1747-ASB features an industrial-grade design with higher density, rich I/O capacity, high PCIe backplane throughput, and lower latency. All modules offer redundancy and hot-swappability. In addition, the IO modules support advanced LAN bypass functionality, and to meet the high bandwidth requirements of future 5G networks, each compute module is designed to support dual 64G bandwidths, with even higher bandwidths supported through expansion of the IO card. Offering a complete solution with optimized stacks, high throughput and an expanding partner ecosystem for mix-and-match hardware and software configurations, MICA offers compute modules based on Intel Core/Xeon and other processor-based motherboards, switch modules, storage modules and IO modules that can be easily customized and scaled to meet customer needs.