LSU-113DG

The LSU-113DG is available in two types of ruggedized edge AIoT platforms for next-level workload integration capabilities in different vertical markets. iEPF-9000S series Expendable Edge AIoT platforms feature flexible configurations and expansion slots for a variety of expansion cards; iEP-9000E series compact edge AIoT platforms feature passive cooling solution for a space-saving, fanless design. Both systems are powered by Intel® 10th generation Xeon® W and Core i7/i5/i3 processors (Comet Lake) with W480E, Q470E, and H420E chipsets, providing superb computing power and supporting a total of 4 DDR4 SO-DIMM slots up to 128GB, a significant upgrade in memory size and ideal for edge Artificial Intelligence applications.

LSU-113DG Features:
Meets or exceeds NEMA Premium efficiency rating
Inverter operating system
10:1 variable and constant torque on VFDs with 1.0 service factor
Sine wave service factor of 1.15; IGBT power service factor of 1.0
Class F insulation
Continuous operation at 40°C
Rolled steel construction with C-face rigid base mounting
F3 junction box location
Utilizes ball bearings
Electrically reversible
UL recognized and CSA certified