UCD224A103 3BHE023681R0103 3BHE023682P201

Industrial Level I/O Modules
UCD224A103 3BHE023681R0103 3BHE023682P201 There are two types of ruggedised Edge AIoT platforms for next-generation workload integration capabilities across different vertical markets. iEPF-9000S Series Scalable Edge AIoT platforms feature flexible configurations and an expansion slot design for a variety of expansion cards; The iEP-9000E series compact Edge AIoT platform features a space-saving and fanless design with passive cooling solutions. Both systems are powered by Intel® 10th generation Xeon® W and Core i7/i5/i3 processors (Comet Lake) with the W480E, Q470E and H420E chipsets, which provide superior compute power and support a total of four DDR4 SO-DIMM slots up to 128GB, a significant upgrade in memory size ideal for Edge AI applications. applications.

The UCD224A103 3BHE023681R0103 3BHE023682P201 supports PoE for reliable connectivity with four USB 3.2 Gen2, three USB2.0, six COMs (4 x RS-232/422/485, 2 x RS-232), eight DI/DOs (supporting 2.5KV isolation) and provides excellent visual effects through a triple display with two display ports and a VGA, plus four SATA3 with hot-swappable trays for 2.5-inch SSDs or HDDs (CFast option). iEPF-9000S series features a flexible expansion slot design that supports one PCIe x16 (Gen 3) or two PCIe x8 (Gen 3) and Two PCIe x4 can be used for a variety of expansion cards such as graphics cards, frame grabbers, motion cards, and IO cards. There are also various slots for RF modules and storage, an M.2 Key M for NVMe/SATA SSDs, an M.2 Key B for 4G/5G, an M.2 Key E for Wi-Fi/BT, and two Mini PCIe for optional modules.